3D IC Integration and Packaging (Electronics) - download pdf or read online

By John H. Lau

A entire consultant to 3D IC integration and packaging technology

3D IC Integration and Packaging absolutely explains the most recent microelectronics recommendations for expanding chip density and maximizing functionality whereas decreasing energy intake. in accordance with a path constructed via its writer, this useful consultant bargains real-world problem-solving tools and teaches the trade-offs inherent in making system-level judgements. discover key permitting applied sciences equivalent to TSV, thin-wafer energy size and dealing with, microsolder bumping, redistribution layers, interposers, wafer-to-wafer bonding, chip-to-wafer bonding, 3D IC and MEMS, LED, and complementary metal-oxide semiconductor picture sensors integration. meeting, thermal administration, and reliability are coated in entire detail.
3D IC Integration and Packaging covers:
3D integration for semiconductor IC packaging
Through-silicon vias modeling and testing
Stress sensors for thin-wafer dealing with and energy measurement
Package substrate technologies
Microbump fabrication, meeting, and reliability
3D Si integration
2.5D/3D IC integration
3D IC integration with passive interposer
Thermal administration of 2.5D/3D IC integration
Embedded 3D hybrid integration
3D LED and IC integration
3D MEMS and IC integration
3D CMOS snapshot sensors and IC integration
PoP, chip-to-chip interconnects, and embedded fan-out WLP

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3D IC Integration and Packaging (Electronics) by John H. Lau


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